Jiangyin Changdian Advanced Packaging Co., Ltd (hereinafter referred to as “JCAP”) is a national high-tech enterprise integrating the R&D and manufacturing. JCAP was established by the domestic leading packaging & testing enterprise Jiangsu Changdian Electric Technology Co., Ltd and Singapore APS in 2003.
JCAP locates in Jiangyin ,Wuxi, a small beautiful town in the south of Yangtze River, which is three hours’ drive from Shanghai Pudong International Airport. The registered capital of JCAP is 51 million dollars. So far, the company has two production bases, which are B1 and B2, and the total number of employees is more than 1000.
JCAP is the proposer and forerunner of the packaging theory in the middle end of semiconductor integrated circuit, the biggest bumping house in China and also the leading WLCSP production base all over the world; it owns the most advanced packaging technology R&D service platform and initiated many “first” in domestic semiconductor packaging & testing industry.
Technical research and achievement transformation are the focus of the company. JCAP undertook national 02 major special advanced packaging projects and Jiangsu achievement transformation projects many times, established good and long-term industry-university-research cooperation relationship with a number of well-known colleges and universities, such as Southeast University, Fudan University, Metal institution of Chinese Academy of Sciences, Shanghai Microsystems institution of Chinese Academy of Science, etc; JCAP is widely recognized by the Ministry of Science and Technology, Ministry of Industry and Information Technology and Jiangsu Science and Technology Agency, and considered as the enterprise model of Chinese semiconductor advanced packaging technology.