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JCAP Corp.(Jiangyin Changdian Advanced Packaging Co.,Ltd) was founded in August 2003.The facilities are located in Jiangyin, China(About 3 hours drive to the Shanghai Pudong Airport).The Major businesses are dedicated in bumps(Solder bump, Gold bump, Pillar bump)mass production. Pillar bumps have more advantages such as fine bump pltch(<180um),maintain standoff of 70-90um,ease of underfill,etc.JCAP is the unique factory who has the patent to produce Pillar bump in the World. |
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These bumps basically are used on LCD driver IC, RF IC. ect, the bumps package types can be divided into COG(Chip on Glass),COF(Chip on Film),TCP(Tape Carrier Packaging), and Flip Chip application.Their end product applications mainly are for portable products such as notebook computer,cellular phone, and digital camcorder, as well as smart card,automobile parts, and consumer electoronics.Besides, JCAP had developed WLCSP(Wafer Level Chip Scale Package)technology to remain the leading position. |
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The main share holders are Jiangsu Changdian Electronics Technoloty Co.,Ltd.Now JCAP are dedicated to bumping 5",6" and 8" wafers.Production capacity was expanded to 25K wafers per month for bumps by the end of 2004.JCAP have been qualified by many large companies to provide mass production bumping services. |
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