1. Service
    1. BUMPING
    2. Wafer Probe
    3. WLCSP
    4. RFID
    5. ECP
    6. TSV

TSV Technology Development and Application

One of the OSATs to establish MEOL and BEOL capabilities, JCAP is playing an important role in this emerging interconnect technology, and has been focused on developing high volume manufacturing capabilities at cost points that make TSV a commercially viable solution. JCAP has also been involved in a number of collaborative efforts with customers and China leading foundries to develop an effective business model for TSV related packaging solutions, such as CIS, 2.5D interposer, MEMS etc.