1. Service
    1. BUMPING
    2. Wafer Probe
    3. WLCSP
    4. RFID
    5. ECP
    6. TSV

Wafer Probe

Test Services Overview

Semiconductor chips are rapidly increasing in complexity, requiring more advanced test systems and capabilities. We provide customers with a full suite of test platforms and engineering services to support a broad range of mixed signal, analog and high-performance digital semiconductor devices. Our full turnkey test services, which include wafer bump, probe, deliver the lowest cost of test for our customers with the highest possible throughput and faster time-to-market.

 

Test Facilities

• Test Platforms

• Wafer Sort

Test Development Services

• Analog Test

• Mixed Signal Test

• High-End Digital Test

• Integrated Test Management System

Operational Excellence

The entire test process is established within a rigid framework of zero-defects quality assurance that delivers peace of mind to all JCAP customers.

Lowest Cost of Test

JCAP combines operational efficiencies with its proven capabilities and competency to achieve the lowest cost of test (COT) with the highest possible throughput.

Test Solutions Partner

By engaging JCAP early in the product development process, customers benefit from JCAP’s experience and guidance for a rapid, predictable and problem-free production ramp.